SMT & PCBA, 01005 to 0.3 mm BGA.
High-mix SMT assembly on the Bao’an campus — nine SMT lines and five DIP lines holding one million placements a day per flagship line, every board past SPI, AOI, X-ray and 100% ICT/FCT before release.
SMT from 01005 to 0.3 mm BGA.
The same line runs a fingertip-sized module and a server board back to back. High-mix is the job, not the problem: 3.2M boards a month of joint capacity, changeover kept short and the IPC-A-610 standard on every run — whether the batch number is eleven or eleven thousand.
Line facts.
| Parameter | Capability |
|---|---|
| SMT lines | 9 SMT + 5 DIP on the 45,000 m² Bao’an campus |
| Component range | 01005 passives to 0.3 mm BGA pitch; 0402 standard placements |
| Placement capacity | 8M points/day across the network; 1M points/day per flagship line |
| Output | 3.2M boards/month joint capacity |
| Stencil & joint inspection | SPI paste inspection, AOI after every reflow, X-ray for BGA/QFN |
| Test | ICT and FCT — 100% test and traceability before release |
| Workmanship | IPC-A-610 Class 2/3 acceptance; IPC Class 3 for industrial programs |
| ESD | Protected-area floors, ESD-safe tools and logged wrist-strap checks |
| Floor discipline | 6S workfloor; lead-free process with RoHS/REACH-compliant consumables |
| Quality system | ISO 9001 certified; IATF 16949-audited processes on automotive programs |
| Yield management | First-pass yield tracked per SKU from NPI; reflow profiles kept under SPC |
Release gate, on record.
# batch release inspection · PCBA per BOM-2417 · IPC-A-610
qc-gate inspect --standard ipc-a-610 --test 100%
[spi] paste volume, offset, area ......... PASS
[aoi] post-reflow, 100% coverage ......... PASS
[xray] BGA & QFN voiding criteria ......... PASS
[ict] every net, every pin ............... PASS
[fct] functional program, unit test ...... PASS
[esd] wrist straps logged, mats grounded . PASS
RESULT: PASS — released for box build. traceability attached.
Questions assemblers get asked.
What is the minimum order for a PCBA run?
Prototype batches start at 1–100 pcs. Because nine SMT lines run on a single planning board, a small batch does not fight production for a slot — it drops onto a qualified line under the same IPC-A-610 standard as volume, at its own rate.
How do you hold quality on high-mix work?
The gate is layered and non-optional: SPI paste inspection before reflow, AOI after it, X-ray on BGA and QFN joints, then ICT and FCT at 100% coverage with per-unit traceability. First-pass yield and reflow statistics are reviewed per SKU from NPI onward, and the report attached to your batch belongs to you.
What does a board have to fit to run here?
Chips from 01005 passives up to 0.3 mm BGA pitch, on boards that fit the line’s panel size. If a program needs capability outside that window, or faster output than the network’s 8M points/day, we say so before the quote — not after the order.
Send one RFQ.
Your BOM, board files and a target rate — assembly engineering replies within 24–48 hours with line time, test plan and a costed quote.
Request a quote