P-01
Impedance decides the stackup
Rogers, PTFE and mixed-dielectric builds only work inside a fabrication envelope that can hold controlled impedance.
Source · network fabrication envelope
Industry · telecom & networking · Group C manufacturing sites · Shenzhen
A networking programme is decided before the first board: by impedance control, by consistency at a second site, and by the EMC class the box may enter.
01Pain points · what decides the programme
Each figure carries the source it came from.
P-01
Rogers, PTFE and mixed-dielectric builds only work inside a fabrication envelope that can hold controlled impedance.
Source · network fabrication envelope
P-02
The same BOM produced at two sites diverges on impedance, warp and cosmetics, so the site is the unit of qualification.
Measured · 13 September 2026
P-03
FCC Part 15 Class A is for commercial and industrial sale and excludes residential; Class B is the residential class.
Source · 47 CFR Part 15
P-04
62368-1 has four distinct events, and the 4th edition drops acceptance of components approved to 60950 or 60065.
Source · UL · CENELEC
02Technical requirements · written into the spec
| Parameter | Published value | Basis |
|---|---|---|
| Fabrication | 1–58 layers; 0.1 mm trace and space; 0.2–3.2 mm thickness; 0.15 mm drill | Group C envelopes |
| Copper and holes | Outer copper 1–8 oz, inner 1–4 oz; PTH ±0.08 mm; annular ring 0.15 mm | Published tolerances |
| Assembly | 0201/01005 minimum; 75,000–80,000 CPH; 3D SPI, 3D AOI and X-ray | Two Group C sites |
| Acceptance documents | IPC-A-600M, IPC-6012F, J-STD-001J, IPC-A-610J | Current revisions |
03Connection layer · what we supply
Every figure on these cards is a site's own published product or capability number.
C-01
Multilayer, HDI, flex and rigid-flex with assembly and turnkey box build, from a Shenzhen plant working since 1998.
Group C · lists ISO 9001 and UL 796
C-02
Prototype to mass production with 3D SPI, 3D AOI and X-ray at every stage, and a free DFM review inside 24 hours.
Group C · lists ISO 9001, IATF 16949, ISO 13485
C-03
One prototype or ten thousand units on the same line, with a minimum component size of 0201/01005.
Group C · lists ISO 9001 and ISO 13485
C-04
Vibration, angle and microwave radar modules, built with their own PCB, FPC and PCBA lines under MES traceability plus functional test.
Group C · lists ISO 9001 and RoHS
E-01
28 models across six form factors from 2.5-inch to Mini-ITX and NUC, qualified from −20 to +60 °C on 9–36 V DC.
Group E · lists CE, FCC and CCC
04Trust layer · standards that apply
05Programme archetypes · anonymised
Archetypes are drawn from partner-published capability and product data. No customer is named and no client logo appears anywhere on this site.
06Start
Layer count, dielectric, finish, acceptance class, annual volume and the markets you sell into.
A written stackup review follows, from eric@dfshk.cn.
Start · short form
One line is enough to start. An engineer answers, not a chatbot.
We answer from eric@dfshk.cn. If you have a drawing or a spec sheet, reply to that message and attach it.