EMS–TRADE Electronics export trading
A high-layer-count backplane held at a raking angle in a black inspection fixture, its dense fine traces and rows of press-fit pins reading as an even texture

Industry · telecom & networking · Group C manufacturing sites · Shenzhen

Telecom, networking & 5G

A networking programme is decided before the first board: by impedance control, by consistency at a second site, and by the EMC class the box may enter.

Layer envelope
1–58
Layers published by one Group C fabrication site, with 0.1 mm trace and space
Placement
80k CPH
Single-line placement rate published at one Group C assembly site
Coverage
12/24
Sites listing ISO 9001 — 15 list RoHS, 15 list CE, two list none
EMC split
A / B
FCC Part 15 Class A excludes the residential market; Class B is the residential class

01Pain points · what decides the programme

Four numbers that decide the build.

1–58 layers12 / 24 ISO 9001FCC Part 15 A / B

Each figure carries the source it came from.

An engineer's test bench in a dim clean room: a rack-mount oscilloscope with an unlit screen, a bench power supply with blank readouts and a finished board assembly under a magnifier arm P-01

Impedance decides the stackup

Rogers, PTFE and mixed-dielectric builds only work inside a fabrication envelope that can hold controlled impedance.

0.1 mm trace1–58 layers0.15 mm drill

Source · network fabrication envelope

A finished board assembly in a machined aluminium housing beside a bare multilayer production panel resting in a white inspection fixture P-02

The second site is where consistency dies

The same BOM produced at two sites diverges on impedance, warp and cosmetics, so the site is the unit of qualification.

12 / 24 ISO 900115 / 24 RoHS2 list none

Measured · 13 September 2026

Four finished rack-mount network switches standing in a row, closed faceplates with empty port cages P-03

EMC class decides the market

FCC Part 15 Class A is for commercial and industrial sale and excludes residential; Class B is the residential class.

Class B 66–56 dBµVClass A 79/663 m vs 10 m

Source · 47 CFR Part 15

A single technical drawing sheet seen from above with a pen, dividers and one tab marking a clause P-04

Certification dates are not interchangeable

62368-1 has four distinct events, and the 4th edition drops acceptance of components approved to 60950 or 60065.

2020-12-202025-07-10DOW 2027-02-15

Source · UL · CENELEC

02Technical requirements · written into the spec

What a hardware engineer releases a stackup against.

IPC-A-610JJ-STD-001JIPC-6012F
Fabrication, assembly and acceptance, from the sites' published envelopes
ParameterPublished valueBasis
Fabrication1–58 layers; 0.1 mm trace and space; 0.2–3.2 mm thickness; 0.15 mm drillGroup C envelopes
Copper and holesOuter copper 1–8 oz, inner 1–4 oz; PTH ±0.08 mm; annular ring 0.15 mmPublished tolerances
Assembly0201/01005 minimum; 75,000–80,000 CPH; 3D SPI, 3D AOI and X-rayTwo Group C sites
Acceptance documentsIPC-A-600M, IPC-6012F, J-STD-001J, IPC-A-610JCurrent revisions
A close view down one SMT line, pick-and-place heads and feeder reels in strict alignment
Fig. 01Process data is the evidence. Placement, SPI and AOI records are what a repeat build is judged on.
A flat technical diagram of a route line with four stage markers and two teal transfer bars
Fig. 02Every stage carries a limit. Fabrication, assembly, test and shipment are separate acceptance events.
A cross-sectioned plated through-hole seen through a microscope objective, the copper barrel wall and the laminate layers in clinical laboratory light
Fig. 03Acceptance has a document behind it. Where Class 3 applies, a sectioned coupon is what a claim is checked against.

03Connection layer · what we supply

Five independently operated sites behind one contract.

Group C · 4 sitesGroup E · 1 site

Every figure on these cards is a site's own published product or capability number.

A finished populated circuit board assembly for a power supply laid flat, photographed from directly above with a processor, heatsinks and terminal blocks in view C-01

Saturn PCBA — 1–58 layer fabrication

Multilayer, HDI, flex and rigid-flex with assembly and turnkey box build, from a Shenzhen plant working since 1998.

1–58 layers9 SMT + 4–5 DIPNo MOQ

Group C · lists ISO 9001 and UL 796

Pick-and-place heads and feeder reels aligned along a single SMT line, seen close down the line C-02

Whale PCBA — 2–32 layers, 8 SMT lines

Prototype to mass production with 3D SPI, 3D AOI and X-ray at every stage, and a free DFM review inside 24 hours.

8M placements/day98.7% on-time30+ countries

Group C · lists ISO 9001, IATF 16949, ISO 13485

A finished populated circuit board assembly standing upright on edge, a matte black heatsink across its upper half and a row of connectors below C-03

Uppcba — prototype to mid-volume

One prototype or ten thousand units on the same line, with a minimum component size of 0201/01005.

No MOQ75,000 CPH99.7% first-pass

Group C · lists ISO 9001 and ISO 13485

A finished board assembly in a machined housing beside a bare multilayer production panel held in a white inspection fixture C-04

Kingdta — sensor and radar modules

Vibration, angle and microwave radar modules, built with their own PCB, FPC and PCBA lines under MES traceability plus functional test.

6 SMT + 6 DIP±0.03 mmChinese-language site

Group C · lists ISO 9001 and RoHS

Two finished industrial computers side by side on a pale bench, one a slim fanless Mini-ITX enclosure with heatsink fins, the other a rack-mount unit E-01

GEOLiNK — industrial motherboards

28 models across six form factors from 2.5-inch to Mini-ITX and NUC, qualified from −20 to +60 °C on 9–36 V DC.

6 form factors−20/+60 °C28 models

Group E · lists CE, FCC and CCC

04Trust layer · standards that apply

Codes only, stated for what each one covers.

No holder namesNo certificate numbersNo bare CE claim
01 UL 796 is the bare-board standard UL's own vocabulary is Listed and Recognized Component, not a mark of its own; the catalogue lists the edition as Active without a year.
02 FCC Part 15 has two compliance routes §15.101 lets most unintentional radiators use SDoC or Certification. Scanners, radar detectors and Access BPL must be Certified.
03 CE is a declaration, not a certificate The manufacturer signs an EU Declaration of Conformity, covering EMC 2014/30/EU, the Low Voltage Directive and RoHS as applicable.
04 REACH has no mark at all Its obligation is information under Article 33 above 0.1% w/w. RoHS restricts ten substances, cadmium at 0.01%.
One technical drawing sheet on a pale surface with a pen, dividers and a single tab marking a clause
Fig. 04A claim has to survive a document. Scope, site address and revision are what a buyer compares.
A production panel of identical bare boards held in a white inspection fixture, gold pads and teal solder mask
Fig. 05The unit of acceptance is the board. A quality system covers a site's process, never a single part number.
Digital calipers closed around a machined aluminium housing beside a blank inspection checklist and a sealed sample bag
Fig. 06A measurement needs a record. Calibration data is the artefact behind any metering or tolerance claim.
Five items in a row on a pale ground: a blank lot tag, a shallow SMT batch tray of identical boards, a functional-test fixture, a sealed module and a small sealed carton
Fig. 07The chain a claim is checked against. Lot tag, batch tray, test fixture, sealed unit, carton.

05Programme archetypes · anonymised

Three shapes of programme, no names attached.

1–58 layersDFM in 24 hNo MOQ
A bright assembly hall seen down a central aisle between two rows of identical SMT machines
AA backplane programme. High layer count with controlled impedance, flying-probe and AOI on the bare board, 9 SMT lines plus 4–5 DIP.
An SMT line seen down its length: pick-and-place machine, reflow oven and boards on the conveyor
BAn edge-device programme. 8 automated SMT lines, 8 million placements a day, X-ray at every stage, DFM review inside 24 hours.
An engineering bench under an inspection lamp with a finished board assembly, a magnifier arm and sample connectors
CA mixed SMT and DIP radio unit. One prototype or ten thousand units, 0201/01005 minimum, ±0.03 mm placement, MES traceability plus functional test.

Archetypes are drawn from partner-published capability and product data. No customer is named and no client logo appears anywhere on this site.

06Start

Send us your stackup and impedance targets.

Layer count, dielectric, finish, acceptance class, annual volume and the markets you sell into.

Recorded. An engineer will reply.

A written stackup review follows, from eric@dfshk.cn.

What comes back eric@dfshk.cn · +86 152 3512 7440